15 0 obj << 53 0 obj The MAP-molded, sawn type is the standard for NXP's packages.
61 0 obj (5.2 QFN Packages) >> Figure 3. /D [61 0 R /XYZ 56.693 281.745 null] A /D [167 0 R /XYZ 56.693 447.979 null]
AN005:ICPackage/PCBFootprintGuidelines-QFN325x5•ApplicationNote•DocumentRevisionV1.00•2017-June-13 3/7 4.2 Dimensions Figure2:QFN32(5x5mm)packageoutlinedrawings endobj
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This package uses perimeter lands on the bottom of the package to provide electrical contact to the Printed Wiring Board (PWB). 20 0 obj /Title 35 0 R >>
The perimeter connections (not the heat sink in the middle) […] endobj
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/D [151 0 R /XYZ 56.693 748.335 null] endobj /A 44 0 R The package design is leadframe based. <<>>
/Title 11 0 R endobj These QFN packages are available in alumina or aluminum nitride ( AlN ) ceramics and feature air cavity and low loss broad band transitions for excellent RF & Microwave performance. 14 0 obj /Prev 22 0 R
endobj 51 0 obj
/D [161 0 R /XYZ 56.693 252.48 null] endobj
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/Parent 202 0 R >> /D [151 0 R /XYZ 56.693 683.894 null] Figure 4.1 to 4.4 show drawings of a typical QFN package and its corresponding PCB footprint, Table 4.1 summarize the recommended formulas and values to calculate dimensions in Y (vertical) direction for PCB footprint as well as thermal vias based on following design guidelines, the formulas and values are also
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23 0 obj %���� Our Testing and Quality Control Manager, Pete Lewis, figured out a good system to utilize Eagle's built-in image importer so that we could get exact footprints created for the problem parts. %PDF-1.5 56 0 obj
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/Prev 34 0 R << >> <<>> << 46 0 obj 31 0 obj (6 Revision History) 77 0 obj << << >> endobj /Count 3 In addition, QFN packages offer excellent electrical performance because their leads are shorter than those of extended lead packages. /D [151 0 R /XYZ 56.693 146.607 null] /Next 50 0 R
<< << /Title 19 0 R 9 0 obj (4.3 Land Pattern)
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10 0 obj QFN package dimensions and tolerances, refer to the “Packaging Specification” (DS00000049). Comparison of sawn-type and punch-type QFN Both package types are JEDEC-compliant designs.
endobj Cypress QFN-packaged devices have a contact pitch of 0.5 mm, 0.4 mm, or 0.35 mm and a thickness of 1.0 mm, 0.6 mm, or 0.4 mm, depending on the product. 26 0 obj endobj
Some versions have small extensions of these connections that wrap around the bottom corner and come up the edge a little. /Parent 34 0 R endobj /D [167 0 R /XYZ 56.693 285.513 null] <<
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The land pattern design for all QFN type packages is based on the IPC-7093 and IPC-7351 standards. <<
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endobj << /S /GoTo /D (subsection.18) >> /Title 27 0 R /D [125 0 R /XYZ 56.693 384.435 null] /D [161 0 R /XYZ 56.693 547.941 null] >>
(2 Tables Index) endobj <<
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49 0 obj <>/Metadata 574 0 R/ViewerPreferences 575 0 R>>
(5.1 QFP Packages)
endobj endobj 21 0 obj endobj /Title 55 0 R <>/ExtGState<>/XObject<>/ProcSet[/PDF/Text/ImageB/ImageC/ImageI] >>/Annots[ 13 0 R] /MediaBox[ 0 0 612 792] /Contents 4 0 R/Group<>/Tabs/S/StructParents 0>> 54 0 obj /A 52 0 R 33 0 obj
/D [125 0 R /XYZ 56.693 584.818 null] (5.3 FBGA Packages) <>>>/Length 852/Filter/FlateDecode>>stream << /S /GoTo /D (section.3) >> (4.1 QFN32 5x5) <<
/Title 43 0 R 35 0 obj This led to reflow problems in our ovens, caused shifted parts, tombstones, and many, many jumpers to ground, especially on our QFN package ICs. endobj 43 0 obj The packag e footprint and outlines are covered under JEDEC MO-247: Plastic Quad No-lead Staggered Multi-Row Packages (with Optional Thermal Enhancements) and JEDEC Design Guide 4.19: Quad No-lead Staggered Multi-Row Packages. Plastic near Chip Scale Package with a leadframe substrate. 17 0 obj /Next 34 0 R 1 0 obj
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