Your options are : Thank You for interest in Maxim Integrated. /Filter /FlateDecode Package Thermal Resistance Values (Theta JA, Theta JC) for Dallas Semiconductor Temperature Sensors Abstract: Two common thermal-resistance values measured for IC packages are junction to ambient (Theta JA) and junction to case (Theta JC). <<3EE9B1EE4FAD5D43919E8569834137C1>]>> The content on this webpage is protected by copyright laws of the United States and of foreign countries. <>stream JX In JEDEC standards, thermal characterizations of a semiconductor device require measurement of the junction. stream Please provide as much detail as possible in your answers. Theta JA and Theta JC Values for Other Temperature Sensors : 8-Pin DIP.300: 8-Pin SO.150: 8-Pin SO.208: 3-Pin PR-35: 3-Pin T0-92: 3-Pin SOT23: 5-Pin SOT23 : 8-Pin µSOP/µMAX: 8-Pin µSOP Ex. stream Thermal Resistance vs Chip Size Note: 14x20mm 56 TSOP package … 0000001676 00000 n 0 0000002787 00000 n 0000009520 00000 n %���� <<
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%���� Package Information Thermal Characterization of Packaged Semiconductor Devices TB379Rev.4.00 Page 3 of 13 August 10, 2015 The Concept of Thermal Resistance A common method of characterizing a packaged device's thermal performance is with “thermal resistance”, denoted by the Greek letter “theta” or . /GS1 7 0 R Please What project(s) will these Maxim parts be used in? Packages Table 2 shows the thermal resistance data that was col-lected using the 4-layer method described in the EIA standard JC51-7, high thermal conductivity case. << trailer %PDF-1.2 172 0 obj <>endobj For a semiconductor device, thermal
Knowing these package thermal-resistance values can help the system designer evaluate the thermal performance of different package types.
0000004534 00000 n MATERIAL THERMAL CONDUCTIVITY PROPERTIES Material Thermal Conductivity (W/mK) Silicon 145 Mold Compound 0.7 Lead Frame 277 Die Attach Epoxy 2.4 Copper 388 FR4 PCB 0.35 SnAgCu Solder 57.3 63Sn37Pb Colder 50 Figure 2. /Title (IC26_CHAPTER_6_2000)
The thermal resistance for a particular application can and will vary widely depending on the external factors that affect the thermal resistance from junction to ambient.
/ExtGState <<
0000003275 00000 n endstreamendobj173 0 obj<>endobj174 0 obj<>endobj175 0 obj<>/ColorSpace<>/Font<>/ProcSet[/PDF/Text/ImageC/ImageI]/ExtGState<>>>/Type/Page>>endobj176 0 obj[177 0 R 178 0 R 179 0 R 180 0 R 181 0 R 182 0 R 183 0 R 184 0 R 185 0 R]endobj177 0 obj<>/A<>/Border[0 0 0]>>endobj178 0 obj<>/A<>/Border[0 0 0]>>endobj179 0 obj<>/A<>/Border[0 0 0]>>endobj180 0 obj<>/A<>/Border[0 0 0]>>endobj181 0 obj<>/A<>/Border[0 0 0]>>endobj182 0 obj<>/A<>/Border[0 0 0]>>endobj183 0 obj<>/A<>/Border[0 0 0]>>endobj184 0 obj<>/A<>/Border[0 0 0]>>endobj185 0 obj<>/A<>/Border[0 0 0]>>endobj186 0 obj<>endobj187 0 obj[/Indexed/DeviceRGB 7 197 0 R]endobj188 0 obj<>endobj189 0 obj<>stream H����o� ����ўd08fMڦ��)������kl�&꿿�8�ڦڴ����=`�%W�+۞0������kЂQm��"_-�����V�1T8!iRIZ��7o���{%����/�H�3��R�2��`g�)�w����7��W���~|X-f��4�&���?�=Z��ZGgB�%H�N�I�>��rU�6�Ǣ]�9�a��i�W") ϶_�;�����>���(̍Q���:��Z߹p좔M����ƕ��zpU�qK��启�p��R � e*��:y��:dgP��9�Π�ˉT�ߐ^b`�>���]��ӌ)cF��� i�������Bt�t�n�Au"���'�1��X��[ðq��������bY�����%��~r�:y�-��9���6���>%�4�B̈́��E4��)������>�(/ce1 �_/��m��;h]��9�RH6��NJ��` ���l
/ModDate (D:20040406145204) Equivalent Thermal Resistance … Table 1. Thermal Simulation Results Comparison Thermal Metric TPS563201 TPS560200 Unit SOT SOT θJA Junction-to-ambient thermal resistance 92.6 166.8 °C/W θJC(top) Junction-to-case(top) thermal resistance 48.5 100 θJB Junction-to-board thermal resistance 15.5 75.5 θJT Junction-to-top characterization parameter 2.5 29.2 >> Visit maxim_web:en/products/comms/optical-comms,maxim_web:en/products/comms/wireless-rfmaxim_web:en/products/comms/optical-comms,maxim_web:en/products/comms/wireless-rfThermal characterization of packages is critical for the performance and reliability of IC applications. Thermal Enhanced Leadframes constitute the second group of packages. 0000000016 00000 n /CreationDate (D:19960304113745) The following table lists the device, number of pins, part number, silicon type, package type, and downloadable package drawing for the devices.
1 0 obj
thermal resistance table 1 type package code style lead count theta jc °c/w theta . 0000011384 00000 n
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